Exhibitor Forum
Asetek: Flexibility in Cooling Options: Brownfields & Greenfields
Event Type
Exhibitor Forum
TimeTuesday, June 26th4pm - 4:20pm
LocationBooth N-210
DescriptionThis session discusses the adaptability of Direct to Chip hot water liquid cooling to a variety of heat capture and heat rejection scenarios that are easily addressed with a high reliability, low pressure distributed pumping architecture. From using liquid enhanced air cooling of servers in conjunction with traditional data center air cooling to dedicated rack-level CDUs with direct heat transfer to facilities liquid this session informs on the options available. Emphasis is placed on the practical, hybrid approach of directly cooling with hot water (Direct-to-Chip) the server components that generate the most heat within a server.
Data Center Marketing