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DTSTAMP:20191206T142522Z
LOCATION:Pikkolo
DTSTART;TZID=Europe/Stockholm:20180625T130000
DTEND;TZID=Europe/Stockholm:20180625T140000
UID:isc_hpc_ISC High Performance 2018_sess108@linklings.com
SUMMARY:Preparing to Liquid Cool Your Next HPC Deployment
DESCRIPTION:Birds of a Feather\n\nPreparing to Liquid Cool Your Next HPC D
 eployment\n\nMcGinn\n\nLeading chip manufacturers continue to push computa
 tional boundaries with the release of high TDP processors, which simply pr
 oduce too much heat for traditional air cooled solutions to manage. Key tr
 ends that are driving the cooling industry are increased rack density, max
 imized performance and impr...\n\n\nPasses: Conference Pass, Exhibition Pa
 ss
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