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DTSTART:19700308T020000
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BEGIN:VEVENT
DTSTAMP:20191206T142455Z
LOCATION:Booth N-210
DTSTART;TZID=Europe/Stockholm:20180626T160000
DTEND;TZID=Europe/Stockholm:20180626T162000
UID:isc_hpc_ISC High Performance 2018_sess142_exf136@linklings.com
SUMMARY:Asetek: Flexibility in Cooling Options: Brownfields & Greenfields
DESCRIPTION:Exhibitor Forum\n\nAsetek: Flexibility in Cooling Options: Bro
 wnfields & Greenfields\n\n\n\nThis session discusses the adaptability of D
 irect to Chip hot water liquid cooling to a variety of heat capture and he
 at rejection scenarios that are easily addressed with a high reliability, 
 low pressure distributed pumping architecture. From using liquid enhanced 
 air cooling of servers in conjunction with traditional data center air coo
 ling to dedicated rack-level CDUs with direct heat transfer to facilities 
 liquid this session informs on the options available. Emphasis is placed o
 n the practical, hybrid approach of directly cooling with hot water (Direc
 t-to-Chip) the server components that generate the most heat within a serv
 er.\n\nPasses: Exhibition Pass
URL:https://2018.isc-program.com/presentation/?id=exf136&sess=sess142
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