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DTSTART:19700308T020000
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DTSTAMP:20191206T142453Z
LOCATION:Booth N-210
DTSTART;TZID=Europe/Stockholm:20180625T174000
DTEND;TZID=Europe/Stockholm:20180625T180000
UID:isc_hpc_ISC High Performance 2018_sess204_exf153@linklings.com
SUMMARY:Thercon-LHP: Thercon LHP-technology: CPU cooling and server rack s
 olutions
DESCRIPTION:Exhibitor Forum\n\nThercon-LHP: Thercon LHP-technology: CPU co
 oling and server rack solutions\n\n\n\nLHP (loop heat pipe) heat transfer 
 technology enables a  range of liquid free cooling solutions: optimized ai
 r cooling for 1U, 1,5U servers CPUs with high TDP; server rack cooling sys
 tem -  giving all advantages of liquid cooling but with no liquid inside t
 he server and easy to maintain  \n\n\nLHP is a two-phase heat-transfer de
 vice for providing an effective thermal link between a heat source and a h
 eat sink in cooling systems for HPC. Vaporization and condensation of work
 ing fluid circulating inside the loop of tubes provides heat transfer and 
 capillary forces serve as a driving mechanism. Capillary structure acts as
  a pump with no moving parts providing high reliability and heat is a sour
 ce of energy for heat transfer. Developed for high heat load applications 
 they are easily adaptable, powerful and work with no electric energy consu
 mption.\n\n\nLHP technology provides a wide design variety which extends 
 the application fields and performance capabilities.\n\nPasses: Exhibition
  Pass
URL:https://2018.isc-program.com/presentation/?id=exf153&sess=sess204
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